Important Dates
| First Call for Papers | Jan 20, 2026 |
| Second Call for Papers | Apr 1, 2026 |
| Final Call for Papers | May 1, 2026 |
| Full Manuscript Submission | July 15, 2026 |
| Last day of Acceptance Notification | Aug 1, 2026 |
| Camera Ready Paper Deadline | Aug 7, 2026 |
| Last Day of Payment | Aug 15, 2026 |
| Conference Day | Sept 30 & Oct 1, 2026 |
Register Now!
Are you interested in joining this conference? Please submit your paper now before it’s too late. For more information about registration and paper submission please click button below.
Contact Us
BOND21 CONFERENCE SECRETARIAT
Institute of Nano Electronic Engineering (INEE)
Universiti Malaysia Perlis (UniMAP)
Lot 110, 1st Floor, Block A, Taman Pertiwi Indah, Seriab, Jalan Kangar-Alor Setar, 01000, Kangar, Perlis, Malaysia.
Contact Person: Prof. Ir. Dr. Mohd Khairuddin Md Arshad
Email: bond21@unimap.edu.my