BOND21 is a very important event on Nanoelectronics Engineering and Green Materials calendar and was first hosted by UniMAP in 2013. It represents the liaison and integration of two well-established international interface conferences:

– ICNE (International Conference on Nanoelectronics Engineering, led by Institute of Nano Electronic Engineering (INEE)), And

– EGM (Electronic and Green Materials International Conference), led by School of Microelectronic Engineering and is organized by members of all 2 conferences.

Clearly, bond aspects are very important for nanoelectronics and engineering where high performance, high functionality and low cost are required. There are new-generation elements to accurately transfer other functionalities, such as electronic, electrical, thermal and optical properties, engineering and green materials on the micro- and nano level. The bond challenges brought novel elements based on nanelectronics, engineering and green materials need to be addressed in this context.

The community will be benefited enormously over the years through ICNE and EGM events to understand the theory and application principles. It covers the entire range of basic and applied aspects of the synthesis and characterization, modelling, processing and application of nanoelectronics, engineering and green materials. BOND21 will tackle the issues of the advent of novel materials, structures and applications through a significant worldwide event. BOND21 represents the 21st conference in the area of nanoscience and engineering after the ICNE and EGM events. BOND21 will be jointly co-organized by INEE, UniMAP and School of Microelectronic Engineering, UniMAP.