BOND21 is an international conference on nanoscience and nanoengineering hosted by the Institute of Nanoelectronic Engineering (INEE), Universiti Malaysia Perlis (UniMAP). The conference was first held in 2013 and attracted more than 200 local and international participants. The second BOND21 conference was also highly successful and was organised at the Aston Tropicana Hotel, Bandung, Indonesia, from 27–28 July 2018.

Subsequently, BOND21 was held at Hotel Putra Brasmana, Kuala Perlis, Malaysia, from 22–23 September 2023, followed by the most recent conference at Swiss-Belresort, Belitung Island, Indonesia, on 12–13 August 2024. In 2026, the conference will return to Malaysia and is planned to be held at Bangi Resort Hotel, Bangi, Malaysia, on  30 September to 1 October 2026.

BOND21 believes on the principle of building the nation’s wealth and prosperity through the advancement in science and technology. Therefore, the theme for 2026’s conference is chosen as “Nanoscience and Nanoengineering for Nation’s Growth and Sustainability”.

Nanoscience is the study of structures and materials on the scale of nanometers while nanoengineering is the practice of engineering at the nanoscale. The integration of nanoscience and nanoengineering creates values which indispensable pathway to the advancement of community, nation and civilization. Scientists and engineers from multitude of disciplines including physics, chemistry, biology, materials science use nanoscience principles for advanced applications in energy, electronics, medicine, information technology, computing and others. In short, the applications of nanoscience and engineering permeate in all aspect of life.

In that respect, BOND21 strives on the aspect of binding and bonding nanoscience and nanoengineering in creating high performance materials and devices with optimum cost through deep understanding on the theoretical framework and application principles. BOND21 also strives on maintaining and sustaining clean environment for future generation by promoting environment friendly and renewable aspects in the design and production of the materials and devices. BOND21 hopes to deliver enormous benefits to academicians, engineers and the community at large.