BOND21 is an international conference on nanoscience and nanoengineering, hosted by the Institute of Nanoelectronic Engineering (INEE), UniMAP. It has been firstly hosted in 2013 which attracted more than 200 local and international participants. The 2nd BOND21 conference was also equally successful where it was organized in Bandung, Indonesia from 27th to 28th of July, 2018.

BOND21 believes on the principle of building the nation’s wealth and prosperity through the advancement in science and technology. Therefore, the theme for 2022’s conference is chosen as “Nanoscience and Nanoengineering for Nation’s Growth and Sustainability”.

Nanoscience is the study of structures and materials on the scale of nanometers while nanoengineering is the practice of engineering at the nanoscale. The integration of nanoscience and nanoengineering creates values which indispensable pathway to the advancement of community, nation and civilization. Scientists and engineers from multitude of disciplines including physics, chemistry, biology, materials science use nanoscience principles for advanced applications in energy, electronics, medicine, information technology, computing and others. In short, the applications of nanoscience and engineering permeate in all aspect of life.

In that respect, BOND21 strives on the aspect of binding and bonding nanoscience and nanoengineering in creating high performance materials and devices with optimum cost through deep understanding on the theoretical framework and application principles. BOND21 also strives on maintaining and sustaining clean environment for future generation by promoting environment friendly and renewable aspects in the design and production of the materials and devices. BOND21 hopes to deliver enormous benefits to academicians, engineers and the community at large.